Semiconductor apparatus and method for fabricating the same

ABSTRACT

A semiconductor apparatus includes a semiconductor device to be mounted on a circuit board; a plurality of conductive posts electrically connected to the semiconductor device; and a plurality of conductive bumps each provided on an outer end of each of the conductive posts, so that the plurality of conductive bump is soldered onto the circuit board when the semiconductor device is mounted on the circuit board. A distance between a peripheral edge of the semiconductor device and an outer edge of the conductive post is determined to be narrow so that a solderbility or wetting condition of the conductive bumps can be visibly recognized easily.

CROSS REFERENCE To RELATED APPLICATION

[0001] This application claims the priority of Application No. 2000-128764, filed Apr. 28, 2000 in Japan, the subject matter of which is incorporated herein by reference.

TECHNICAL FIELD OF THE INVENTION

[0002] The present invention relates to a semiconductor apparatus, and more particularly, to a resin-molded semiconductor apparatus and method for fabricating the same.

BACKGROUND OF THE INVENTION

[0003] Recent years, in connection with the rapid spread of potable apparatus, semiconductor apparatus mounted therein is required to be thinner, smaller and lighter. In order to fill this demand, a large number of inventions have been made.

[0004] In fabrication of a conventional semiconductor apparatus, a rewiring pattern, which is made of copper (Cu), is electrically connected to electrode pads of a semiconductor device (semiconductor element). The rewiring pattern is connected to conductive posts, which are made of copper (Cu). The semiconductor device is molded with a resin so that the molding resin has an upper surface on the same plane with upper surfaces of the conductive posts. Solder balls are formed on upper ends of the Cu posts, which are exposed from the molding resin.

[0005] The above-described process is carried out on a semiconductor wafer, which has a plurality of semiconductor devices. The semiconductor wafer is diced to make individual semiconductor apparatuses. The semiconductor devices are mounted on a circuit board or substrate.

[0006] An electrical test is carried out to the semiconductor apparatus mounted on the circuit board. At the same time, solderbility or wetting condition of the solder balls is inspected. Such a solderbility or wetting inspection is important to know mechanical strength of the apparatus, especially used in vehicles which are required with high reliability. However, according to the above-described conventional semiconductor apparatus, the solder balls are arranged at deep inside of the apparatus. As a result, it is difficult to visually recognize the solderbility or wetting condition of the solder balls. The very ends of electrodes are easily applied with outside stress, so that solder balls for those electrodes must be connected reliably.

OBJECTS OF THE INVENTION

[0007] Accordingly, an object of the present invention is to provide a semiconductor apparatus in which solderbility or wetting condition can be visually and easily inspected.

[0008] Another object of the present invention is to provide a method for fabricating a semiconductor apparatus in which solderbility or wetting condition can be visually and easily inspected.

[0009] Additional objects, advantages and novel features of the present invention will be set forth in part in the description that follows, and in part will become apparent to those skilled in the art upon examination of the following or may be learned by practice of the invention. The objects and advantages of the invention may be realized and attained by means of the instrumentalities and combinations particularly pointed out in the appended claims.

SUMMARY OF THE INVENTION

[0010] According to a first aspect of the present invention, a semiconductor apparatus includes a semiconductor device to be mounted on a circuit board; a plurality of conductive posts electrically connected to the semiconductor device; and a plurality of conductive bumps each provided on an outer end of each of the conductive posts, so that the plurality of conductive bump is soldered onto the circuit board when the semiconductor device is mounted on the circuit board. A distance between a peripheral edge of the semiconductor device and an outer edge of the conductive post is determined to be narrow so that a solderbility or wetting condition of the conductive bumps can be visibly recognized easily. In the above-described semiconductor apparatus, preferably, the distance is in a range between 50 to 100 micrometers.

[0011] The semiconductor device may be provided with a plurality of electrode pads connected to the conductive posts, the electrode pads being arranged on a line extending the center of the semiconductor device. In another case, each of the electrode pads may be arranged between two adjacent conductive posts. In still another case, each of the electrode pads being arranged directly under a corresponding conductive post.

[0012] According to a second aspect of the present invention, a semiconductor apparatus includes a semiconductor device to be mounted on a circuit board; a plurality of conductive posts electrically connected to the semiconductor device; a plurality of conductive bumps each provided on an outer end of each of the conductive posts, so that the plurality of conductive bumps are soldered onto the circuit board when the semiconductor device is mounted on the circuit board; and a molding resin which covers a surface of the semiconductor device. The molding resin is shaped to have a step at a peripheral edge of the semiconductor device entirely, the step having upper and lower level portions.

[0013] Preferably, the difference in level between the upper portion and lower portion of the step is half of a thickness of the mold resin. The difference in level between the upper portion and lower portion of the step may be in a range between 40 to 60 micrometers.

[0014] A third aspect of the present invention, a semiconductor apparatus includes a semiconductor device to be mounted on a circuit board; a plurality of conductive posts electrically connected to the semiconductor device; a plurality of first conductive bumps each provided on an outer end of each of the conductive posts, so that the plurality of first conductive bumps are soldered onto the circuit board when the semiconductor device is mounted on the circuit board; a molding resin which covers a surface of the semiconductor device; and an insulating layer which is formed at portions corresponding to the conductive posts and at a peripheral portion of the semiconductor device. The molding resin is shaped to have a peripheral side surface that is on the identical plane with a peripheral side surface of the semiconductor device.

[0015] Preferably, the insulating layer is formed to have a width of 100 to 200 μm. The semiconductor apparatus may further includes a plurality of second conductive bumps each provided on the peripheral side surface of the conductive posts.

[0016] According to a fourth aspect of the present invention, a method for fabricating a semiconductor apparatus includes the steps of: providing a semiconductor wafer on which a plurality of semiconductor devices are formed, each of the semiconductor device having electrode pads thereon; providing a plurality of conductive post connected to the electrode pads of the semiconductor devices; molding the semiconductor devices with a molding resin so that an upper surface of the molding resin is on the same plane with upper surfaces of the conductive posts; removing a part of the molding resin to be located at a peripheral edge so that the peripheral edge of the molding resin has a step, the step having upper and lower level portions; providing conductive bumps on outer ends of the conductive posts; and dicing the semiconductor wafer to form a plurality of individual semiconductor apparatus.

[0017] According to a fifth aspect of the present invention, a method for fabricating a semiconductor apparatus includes the steps of: providing a semiconductor wafer on which a plurality of semiconductor devices are formed, each of the semiconductor device having electrode pads thereon; forming grooves at portions corresponding to dicing lines of the semiconductor wafer; forming an insulating layer on the wafer so that the grooves are filled with the insulating layer but a part of the electrode pad of the semiconductor devices is not covered with the insulating layer; forming a metal layer on the insulating layer and the part of the electrode pads, which is not covered with the insulating layer; forming a rewiring layer on the metal layer; providing a conductive post material that extend across each of the grooves; molding the semiconductor wafer with a molding resin so that an upper surface of the molding resin is on the same plane with upper surfaces of the conductive post material; providing a conductive bump material on each of the conductive post material; and dicing the semiconductor wafer at the grooves to form a plurality of individual semiconductor apparatus.

[0018] Preferably, the method further includes the steps of: expanding the distance between two adjacent semiconductor devices after the dicing process; and reflowing the distanced semiconductor devices so as to form a conductive soldering bump on a peripheral side surface of each of the conductive posts.

BRIEF DESCRIPTION OF THE DRAWINGS

[0019]FIG. 1 is a cross-sectional view showing a part of a conventional semiconductor apparatus.

[0020]FIG. 2 is a cross sectional side view showing the conventional semiconductor apparatus mounted on a circuit board.

[0021]FIG. 3 is a cross-sectional view showing a part of a semiconductor apparatus according to a first preferred embodiment of the present invention.

[0022]FIG. 4 is a plan view showing an arrangement of conductive posts of the semiconductor apparatus, shown in FIG. 3.

[0023]FIG. 5 is a cross sectional side view showing the semiconductor apparatus, shown in FIG. 3, mounted on a circuit board.

[0024]FIG. 6 is a plan view showing an arrangement of electrode pads of the semiconductor apparatus, shown in FIG. 3.

[0025]FIG. 7 is a plan view showing another arrangement of electrode pads of the semiconductor apparatus, shown in FIG. 3.

[0026]FIG. 8 is a plan view showing another arrangement of electrode pads of the semiconductor apparatus, shown in FIG. 3.

[0027]FIG. 9 is a cross-sectional view showing a part of a semiconductor apparatus according to a second preferred embodiment of the present invention.

[0028]FIG. 10 is a plan view showing the semiconductor apparatus, shown in FIG. 9.

[0029]FIG. 11 is a cross-sectional side view showing the semiconductor apparatus, shown in FIG. 9, mounted on a circuit board.

[0030]FIGS. 12A to 12F are cross-sectional views showing fabrication steps of the semiconductor apparatus, shown in FIG. 9.

[0031]FIG. 13 is a cross-sectional view showing a part of a semiconductor apparatus according to a third preferred embodiment of the present invention.

[0032]FIG. 14 is a cross-sectional view showing an enlarged part of the semiconductor apparatus, shown in FIG. 13.

[0033]FIG. 15 is a plan view showing an arrangement of conductive posts of the semiconductor apparatus, shown in FIG. 13.

[0034]FIG. 16 is a cross sectional side view showing the semiconductor apparatus, shown in FIG. 13, mounted on a circuit board.

[0035]FIGS. 17A to 17J are cross-sectional views showing fabrication steps of the semiconductor apparatus, shown in FIG. 13.

[0036]FIG. 18 is a cross-sectional view showing a part of a semiconductor apparatus according to a fourth preferred embodiment of the present invention.

[0037]FIG. 19 is a cross-sectional view showing an enlarged part of the semiconductor apparatus, shown in FIG. 18.

[0038]FIGS. 20A to 20C are cross-sectional views showing fabrication steps of the semiconductor apparatus, shown in FIG. 18.

DETAILED DISCLOSURE OF THE INVENTION

[0039] In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings which forma part hereof, and in which is shown by way of illustration specific preferred embodiments in which the inventions may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention, and it is to be understood that other embodiments may be utilized and that logical, mechanical and electrical changes may be made without departing from the spirit and scope of the present inventions The following detailed description is, therefore, not to be taken in a limiting sense, and scope of the present inventions is defined only by the appended claims.

[0040] For better understanding of the present invention, a conventional technology is first described in conjunction with FIGS. 1 and 2. FIG. 1 is a cross-sectional view showing a part of a conventional semiconductor apparatus. FIG. 2 is a cross sectional side view showing the conventional semiconductor apparatus mounted on a circuit board. A rewiring pattern 3, which is made of copper (Cu), is electrically connected to electrode pads 2 of a semiconductor device (semiconductor element) 1. The rewiring pattern 3 is connected to conductive posts 4, which are made of copper (Cu). The semiconductor device 1 is molded with a resin 5 so that the molding resin 5 has an upper surface on the same plane with upper surfaces of the conductive posts 4. Solder balls 6 are formed on upper ends of the Cu posts 4, which are exposed from the molding resin 5.

[0041] The above-described process is carried out on a semiconductor wafer, which has a plurality of semiconductor devices. The semiconductor wafer is diced to make individual semiconductor apparatuses. The semiconductor devices 1 are mounted on a circuit board or substrate 7, as shown in FIG. 2.

[0042] An electrical test is carried out to the semiconductor apparatus mounted on the circuit board 7. At the same time, solderbility or wetting condition of the solder balls 6 is inspected. Such a solderbility or wetting inspection is important to know mechanical strength of the apparatus, especially used in vehicles which are required with high reliability. However, according to the above-described conventional semiconductor apparatus, the solder balls 6 are arranged at deep inside of the apparatus. As a result, it is difficult to visually recognize the solderbility or wetting condition of the solder balls 6. The very ends of electrodes are easily applied with outside stress, so that solder balls for those electrodes must be connected reliably.

[0043] First Preferred Embodiment

[0044]FIG. 3 is a cross-sectional view showing a part of a resin-molded type of semiconductor apparatus according to a first preferred embodiment of the present invention. The semiconductor apparatus includes a semiconductor device (element) 11; a plurality of electrode pads 12; a rewiring pattern 13; a plurality of conductive posts 14, connected through the rewiring pattern 13 to the electrode pads 13; a mold resin 15 shaped to have an upper surface on the same plane with upper surfaces of the conductive posts; and solder balls 16 provided on upper ends of the conductive posts 14.

[0045] The electrode pads 12 are connecting electrodes, made of aluminum (Al), for the semiconductor devices 11. The rewiring pattern 13, connecting the electrode pads 12 and the posts 14, is made of copper (Cu). The posts 14 are made of copper (Cu) to be pillar shape.

[0046]FIG. 4 is a plan view showing an arrangement of conductive posts 14, in which the rewiring pattern 13, solder balls 16 and electrode pads 12 are abbreviated for easy understanding. On each side of the semiconductor apparatus, the posts 14 are arranged on a straight line extending along the side of the semiconductor apparatus.

[0047] Now referring again to FIG. 3, a distance “d” between a peripheral edge of the semiconductor device 11 and an outer edge of the post 14 is determined to be narrow so that a solderbility or wetting condition of the solder balls 16 can be visibly recognized easily. The distance “d” is preferably determined to be in a range between 50 to 100 micrometers (μm).

[0048]FIG. 5 is a cross sectional side view showing the semiconductor apparatus, shown in FIG. 3, mounted on a circuit board 17. The semiconductor device 11 is mounted on the circuit board 17 with the solder balls 16. The solderbility or wetting condition of the solder balls 16 can be visibly recognized easily.

[0049] As described above, according to the first preferred embodiment of the present invention, distance “d” between the peripheral edge of the semiconductor device 11 and the outer edge of the conductive post 14 is determined to be narrow. As a result, a solderbility or wetting condition of the solder balls 16 can be visibly recognized easily.

[0050]FIG. 6 is a plan view showing an arrangement of electrode pads 14 of the semiconductor apparatus, shown in FIG. 3, in which the rewiring pattern 13 and solder balls 16 are abbreviated for easy understanding. On each side of the semiconductor apparatus, the posts 14 are arranged on a straight line extending along the side of the semiconductor apparatus. The electrode pads 12 are arranged On a line extending the center of the semiconductor device and are connected to the conductive posts 14 via the rewiring pattern 13.

[0051]FIG. 7 is a plan view showing another arrangement of electrode pads 12 of the semiconductor apparatus, shown in FIG. 3, in which the rewiring pattern 13 and solder balls 16 are abbreviated for easy understanding. Each of the electrode pads 12 is arranged between two adjacent conductive posts 14.

[0052]FIG. 8 is a plan view showing another arrangement of electrode pads of the semiconductor apparatus, shown in FIG. 3, in which the rewiring pattern 13 and solder balls 16 are abbreviated for easy understanding. Each of the electrode pads 12 is arranged directly under a corresponding conductive post 14.

[0053] According to the arrangements of the electrode pads 12 shown in FIGS. 6-8, it becomes easy to arrange the conductive posts 14 extending along the side lines (edges) of the semiconductor apparatus. This kind of feature is useful when the semiconductor apparatus is provided with a relatively small number of electrode pads thereon.

[0054] Second Preferred Embodiment

[0055]FIG. 9 is a cross-sectional view showing a part of a semiconductor apparatus according to a second preferred embodiment of the present invention. In this embodiment, the same or corresponding elements to those in the above described embodiments are represented by the same reference numerals. The semiconductor apparatus includes a semiconductor device (element) 11; a plurality of electrode pads 12; a rewiring pattern 13; a plurality of conductive posts 14, connected through the rewiring pattern 13 to the electrode pads 13; a mold resin 15 shaped to have an upper surface on the same plane with upper surfaces of the conductive posts; and solder balls 16 provided on upper ends of the conductive posts 14.

[0056] The electrode pads 12 are connecting electrodes, made of aluminum (Al), for the semiconductor devices 11. The rewiring pattern 13, connecting the electrode pads 12 and the posts 14, is made of copper (Cu). The posts 14 are made of copper (Cu) to be pillar shape.

[0057]FIG. 10 is a plan view showing the semiconductor apparatus, shown in FIG. 9, in which the electrode pads 12, rewiring pattern 13 and solder balls 16 are abbreviated for easy understanding. FIG. 11 is a cross-sectional side view showing the semiconductor apparatus, shown in FIG. 9, mounted on a circuit board 17.

[0058] According to the second preferred embodiment, the molding resin 15 is shaped to have a step (level-difference portion) 18 at a peripheral edge of the semiconductor device entirely. The step 18 includes upper and lower level portions. Preferably, the difference “g” in level between the upper portion and lower portion of the step 18 is half of a thickness “t” of the mold resin 15. More precisely, the difference “g” may be determined to be in a range between 40 to 60 micrometers (μm).

[0059] As described above, according to the second preferred embodiment, the molding resin 15 is provided with the step 18, so that the solder balls 16 is melted when the semiconductor apparatus is mounted on the circuit board 17, as shown in FIG. 11. As a result, a solderbility or wetting condition of the solder balls 16 can be visibly recognized easily.

[0060]FIGS. 12A to 12F are cross-sectional views showing fabrication steps of the semiconductor apparatus, shown in FIG. 9. In fabrication, a wafer 10 on which a plurality of semiconductor device 11 is formed is provided. Next, as shown in FIG. 12A, conductive posts 14 are formed on the semiconductor devices 11 so that the posts 14 are connected through a rewiring pattern 13 (not shown) to electrode pads 12 (not shown) of the semiconductor devices 11. The posts 14 are formed adjacent a peripheral edge of the semiconductor device 11.

[0061] Next, as shown in FIG. 12B, the semiconductor devices 11 are molded with a molding resin 15. The molding resin 15 is formed to have an upper surface higher than the conductive posts 14.

[0062] Subsequently, as shown in FIG. 12C, the upper surface of the molding resin 15 is polished or planed with a polishing device 21 until the upper surfaces (upper ends) of the posts 14 are exposed.

[0063] Referring to FIG. 12D, next, the molding resin 15 is partly removed to form lower level regions that are to be peripheral portions of the molding resin 15 when individual semiconductor apparatuses are formed by a dicing process. The lower level regions have a thickness of 40 to 60 μm. The lower level regions are located between two adjacent posts 14. The peripheral portions of the molding resin 15 correspond to the step 18. To remove the molding resin 15 partly or selectively, the molding resin 15 may be burned out by YAG (Yttrium-Aluminum-Garnet) laser having a 1 μm wavelength.

[0064] Next, as shown in FIG. 12E, solder balls 16 are provided on the exposed upper ends of the posts 14 to form terminals.

[0065] Subsequently, as shown in FIG. 12F, the wafer 20 is diced along dicing lines 19, located at the center of each lower level portions for the steps 18, using a cutter blade 22. As a result, individual semiconductor apparatuses are formed, as shown in FIG. 11.

[0066] As described above, when the molding resin 15 is partly removed using laser or the like, the molding resin 15 can be shaped to have the step 18

[0067] Third Preferred Embodiment

[0068]FIG. 13 is a cross-sectional view showing a part of a semiconductor apparatus according to a third preferred embodiment of the present invention. FIG. 14 is a cross-sectional view showing an enlarged part of the semiconductor apparatus, shown in FIG. 13. In this embodiment, the same or corresponding elements to those in the above described embodiments are represented by the same reference numerals.

[0069] The semiconductor apparatus includes a semiconductor device (element) 11; a plurality of electrode pads 12; a rewiring pattern 13; a plurality of conductive posts 14, connected through the rewiring pattern 13 to the electrode pads 13; a mold resin 15 shaped to have an upper surface on the same plane with upper surfaces of the conductive posts; and solder balls 16 provided on upper ends of the conductive posts 14.

[0070] The electrode pads 12 are connecting electrodes, made of aluminum (Al), for the semiconductor devices 11. The rewiring pattern 13, connecting the electrode pads 12 and the posts 14, is made of copper (Cu). The posts 14 are made of copper (Cu) to be pillar shape. The molding resin 15 is shaped to have a peripheral side surface that is on the identical plane with a peripheral side surface of the semiconductor device 11.

[0071]FIG. 15 is a plan view showing an arrangement of conductive posts of the semiconductor apparatus, shown in FIG. 13, in which the electrode pads 12, rewiring pattern 13 and solder balls 16 are abbreviated for easy understanding. FIG. 16 is a cross sectional side view showing the semiconductor apparatus, shown in FIG. 13, mounted on a circuit board.

[0072] The semiconductor apparatus further includes insulating layers 23 and 24. The insulating layer 23 is formed on an upper surface of the semiconductor device 11. The insulating layer 24 is formed to surround the periphery of the semiconductor device 11 entirely. The insulating layer 24 is formed to be belt shape having a width of 100 to 200 μm at post side regions. The insulating layer 24 may be formed to surround the end face of the semiconductor device 11 entirely.

[0073] According to the third preferred embodiment, as shown in FIG. 12, the solder balls 16 are melted when the semiconductor apparatus is mounted on the circuit board 17; and the melted solder extends to the end face of the conductive posts 14. Therefore, solder strength between the semiconductor apparatus and circuit board 17 becomes higher. Since the semiconductor device 11 is covered at the end face with the insulating layer 24, no short circuit is made even if the solder extends to the side surface of the conductive posts 14.

[0074] As described above, according to the third preferred embodiment, the molding resin 15 is formed to have a side surface (end face) on the same plane with a peripheral side surface (end face) of the semiconductor device 11, so that a solderbility or wetting condition of the solder balls 16 can be visibly recognized easily. Further, the semiconductor device 11 is covered at its peripheral surface (end face) with the insulating layer 24, occurrence of short

[0075] Each of the solder balls 16 is originally shaped to be a half of hemisphere, as shown in FIG. 20B. After reflow process, each of the solder balls 16 is shaped to be hemisphere on the upper end of the post 14, as shown in FIG. 20C. In the situation of FIG. 20B, the solder balls 16 have enough amount of solder; and therefore, lack of solder does not happen in the situation of FIG. 20C.

[0076] As described above, the insulating layer 24, formed on the peripheral side surface of the semiconductor devices 11 entirely, is based on the insulating layer 27 filled in the grooves 26.

[0077] According to the fourth preferred embodiment, the solder bumps 29 can be easily formed on the side surfaces of the conductive posts 14 by a reflow process.

[0078] In the above described embodiments, although solder is used as a material for soldering, other kinds of material, such as zinc alloy and leadless tin alloy, can be used instead. 

What is claimed is:
 1. A semiconductor apparatus comprising: a semiconductor device to be mounted on a circuit board; a plurality of conductive posts electrically connected to the semiconductor device; and a plurality of conductive bumps each provided on an outer end of each of the conductive posts, so that the plurality of conductive bump is soldered onto the circuit board when the semiconductor device is mounted on the circuit board, wherein a distance between a peripheral edge of the semiconductor device and an outer edge of the conductive post is determined to be narrow so that a solderbility or wetting condition of the conductive bumps can be visibly recognized easily.
 2. A semiconductor apparatus according to claim 1, wherein the distance is in a range between 50 to 100 micrometers.
 3. A semiconductor apparatus according to claim 1, wherein the semiconductor device is provided with a plurality of electrode pads connected to the conductive posts, the electrode pads being arranged on a line extending the center of the semiconductor device.
 4. A semiconductor apparatus according to claim 1, wherein the semiconductor device is provided with a plurality of electrode pads connected to the conductive posts, each of the electrode pads being arranged between two adjacent conductive posts.
 5. A semiconductor apparatus according to claim 1, wherein the semiconductor device is provided with a plurality of electrode pads connected to the conductive posts, each of the electrode pads being arranged directly under a corresponding conductive post.
 6. A semiconductor apparatus according to claim 1, wherein the conductive bumps are of solder.
 7. A semiconductor apparatus comprising: a semiconductor device to be mounted on a circuit board; a plurality of conductive posts electrically connected to the semiconductor device; a plurality of conductive bumps each provided on an outer end of each of the conductive posts, so that the plurality of conductive bumps are soldered onto the circuit board when the semiconductor device is mounted on the circuit board; and a molding resin which covers a surface of the semiconductor device, wherein the molding resin is shaped to have a step at a peripheral edge of the semiconductor device entirely, the step having upper and lower level portions.
 8. A semiconductor apparatus according to claim 7, wherein the difference in level between the upper portion and lower portion of the step is half of a thickness of the mold resin.
 9. A semiconductor apparatus according to claim 7, wherein the difference in level between the upper portion and lower portion of the step is in a range between 40 to 60 micrometers.
 10. A semiconductor apparatus according to claim 7, wherein the conductive bumps are of solder.
 11. A semiconductor apparatus comprising: a semiconductor device to be mounted on a circuit board; a plurality of conductive posts electrically connected to the semiconductor device; a plurality of first conductive bumps each provided on an outer end of each of the conductive posts, so that the plurality of first conductive bumps are soldered onto the circuit board when the semiconductor device is mounted on the circuit board; a molding resin which covers a surface of the semiconductor device; and an insulating layer which is formed at portions corresponding to the conductive posts and at a peripheral portion of the semiconductor device, wherein the molding resin is shaped to have a peripheral side surface that is on the identical plane with a peripheral side surface of the semiconductor device.
 12. A semiconductor apparatus according to claim 11, wherein the insulating layer is formed to have a width of 100 to 200 μm.
 13. A semiconductor apparatus according to claim 11, further comprising a plurality of second conductive bumps each provided on the peripheral side surface of the conductive posts.
 14. A semiconductor apparatus according to claim 11, wherein the conductive bumps are of solder.
 15. A method for fabricating a semiconductor apparatus according to claim 7, comprising the steps of: providing a semiconductor wafer on which a plurality of semiconductor devices are formed, each of the semiconductor device having electrode pads thereon; providing a plurality of conductive post connected to the electrode pads of the semiconductor devices; molding the semiconductor devices with a molding resin so that an upper surface of the molding resin is on the same plane with upper surfaces of the conductive posts; removing a part of the molding resin to be located at a peripheral edge so that the peripheral edge of the molding resin has a step, the step having upper and lower level portions; providing conductive bumps on outer ends of the conductive posts; and dicing the semiconductor wafer to form a plurality of individual semiconductor apparatus.
 16. A method according to claim 15, wherein the difference in level between the upper portion and lower portion of the step is half of a thickness of the mold resin.
 17. A method according to claim 15, wherein the difference in level between the upper portion and lower portion of the step is in a range between 40 to 60 micrometers.
 18. A method according to claim 15, wherein the conductive bumps are of solder.
 19. A method for fabricating a semiconductor apparatus according to claim 11, comprising the steps of: providing a semiconductor wafer on which a plurality of semiconductor devices are formed, each of the semiconductor device having electrode pads thereon; forming grooves at portions corresponding to dicing lines of the semiconductor wafer; forming an insulating layer on the wafer so that the grooves are filled with the insulating layer but a part of the electrode pad of the semiconductor devices is not covered with the insulating layer; forming a metal layer on the insulating layer and the part of the electrode pads, which is not covered with the insulating layer; forming a rewiring layer on the metal layer; providing a conductive post material that extend across each of the grooves; molding the semiconductor wafer with a molding resin so that an upper surface of the molding resin is on the same plane with upper surfaces of the conductive post material; providing a conductive bump material on each of the conductive post material; and dicing the semiconductor wafer at the grooves to form a plurality of individual semiconductor apparatus.
 20. A method according to claim 19, further comprising the steps of: expanding the distance between two adjacent semiconductor devices after the dicing process; and reflowing the distanced semiconductor devices so as to form a conductive soldering bump on a peripheral side surface of each of the conductive posts.
 21. A method according to claim 19, wherein the insulating layer is formed to have a width of 100 to 200 μm.
 22. A method according to claim 19, wherein the conductive bumps are of solder. 